8inch SiC Produksi kelas wafer 4H-N SiC substrat
Tabel di handap ieu nunjukkeun spésifikasi wafer SiC 8inch kami:
| 8 inci N-tipe SiC DSP Spésifikasi | |||||
| Jumlah | Barang | Unit | Produksi | Panalungtikan | Dummy |
| 1:paraméter | |||||
| 1.1 | polytype | -- | 4H | 4H | 4H |
| 1.2 | orientasi permukaan | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 |
| 2: Parameter listrik | |||||
| 2.1 | dopan | -- | n-tipe Nitrogén | n-tipe Nitrogén | n-tipe Nitrogén |
| 2.2 | résistansi | emh · cm | 0,015~0,025 | 0.01~0.03 | NA |
| 3: Parameter mékanis | |||||
| 3.1 | diaméterna | mm | 200±0.2 | 200±0.2 | 200±0.2 |
| 3.2 | kandelna | μm | 500±25 | 500±25 | 500±25 |
| 3.3 | Orientasi kiyeu | ° | [1- 100]±5 | [1- 100]±5 | [1- 100]±5 |
| 3.4 | Jerona kiyeu | mm | 1~1.5 | 1~1.5 | 1~1.5 |
| 3.5 | LTV | μm | ≤5 (10mm * 10mm) | ≤5 (10mm * 10mm) | ≤10 (10mm * 10mm) |
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 |
| 3.7 | ruku | μm | -25~25 | -45~45 | -65~65 |
| 3.8 | Leumpang | μm | ≤30 | ≤50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4: Struktur | |||||
| 4.1 | dénsitas micropipe | ea/cm2 | ≤2 | ≤10 | ≤50 |
| 4.2 | eusi logam | atom/cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | ea/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | ea/cm2 | ≤7000 | ≤10000 | NA |
| 5. kualitas hareup | |||||
| 5.1 | hareup | -- | Si | Si | Si |
| 5.2 | finish permukaan | -- | Si-beungeut CMP | Si-beungeut CMP | Si-beungeut CMP |
| 5.3 | partikel | ea / wafer | ≤100 (ukuran≥0.3μm) | NA | NA |
| 5.4 | ngeruk | ea / wafer | ≤5, Total Length≤200mm | NA | NA |
| 5.5 | Ujung chip / indents / retakan / noda / kontaminasi | -- | Euweuh | Euweuh | NA |
| 5.6 | wewengkon polytype | -- | Euweuh | Wewengkon ≤10% | Wewengkon ≤30% |
| 5.7 | nyirian hareup | -- | Euweuh | Euweuh | Euweuh |
| 6: Kualitas deui | |||||
| 6.1 | bérés deui | -- | C-beungeut MP | C-beungeut MP | C-beungeut MP |
| 6.2 | ngeruk | mm | NA | NA | NA |
| 6.3 | Defects deui tepi chip / indents | -- | Euweuh | Euweuh | NA |
| 6.4 | Kasar deui | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Nyirian tukang | -- | Kiyeu | Kiyeu | Kiyeu |
| 7: tepi | |||||
| 7.1 | tepi | -- | Chamfer | Chamfer | Chamfer |
| 8: pakét | |||||
| 8.1 | bungkusan | -- | Epi-siap sareng vakum bungkusan | Epi-siap sareng vakum bungkusan | Epi-siap sareng vakum bungkusan |
| 8.2 | bungkusan | -- | Multi-wafer bungkusan kaset | Multi-wafer bungkusan kaset | Multi-wafer bungkusan kaset |
Diagram lengkep
Produk patali
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